圓片厚度規則
Wafer Thickness Rule
圓片厚度如不在氣派規格內必須將圓片減薄
Back grinding is required if the thickness exceeds CPC spec.
|
產品種類 Product Kind |
封裝形式PKG. Type |
圓片厚度Wafer thickness |
|
DIP/HDIP |
DIP7/8/10/14/16/18/20 |
10~16.8 mil (250~420 um) |
|
HDIP12 |
||
|
Qipai |
Qipai8/16 |
10~12.6 mil (250~350 um) |
|
SOP8 |
SOP7/8/14/16 |
10~12.6 mil (250~350 um) |
|
SOP20/24/28 |
||
|
0.635 SSOP20/24 |
||
|
0.65 SSOP16/20/24/28 |
||
|
1.0 SSOP24 |
||
|
HSOP |
HSOP28 |
10~12.6 mil (250~350 um) |
|
ESOP |
ESOP8/16 |
7~11 mil (180~280 um) |
|
MSOP/EMSOP |
MSOP8/10 |
|
|
EMSOP8/10 |
||
|
TSSOP |
TSSOP8 |
7~8.6 mil (180~220 um) |
|
SOT |
SOT23(Small) |
6.7~8.3 mil (170~210 um) |
|
SOT23-3/5/6 |
||
|
SOT223 |
9.5~13.4mil (240~340 um) |
|
|
SOT89-3/5 |
||
|
LQFP |
LQFP32/48/64 |
8~10 mil (200~250 um) |
|
TSOT |
TSOT23-3/5/6 |
5~7 mil (130~180um) |
|
QFN/DFN |
QFN3X3/4X4/5X5/6X6/7X7 |
7~8.6 mil (180~220 um) |
|
DFN2X2/2X3/3X3/4X4/5X5 |
5~7 mil (130~180um) |
|
|
DFN1006-2/3 |
||
|
TO |
TO252 |
11~13.4 mil (280~340 um) |
|
CPC |
CPC4/5/8/14/16/20/24 |
6.7~8.3 mil (170~210 um) |
|
ECPC |
ECPC14/16/20/24 |
6.7~8.3 mil (170~210 um) |
